Intel’s confidence in its 14A, or 1.4nm-class, semiconductor manufacturing process is growing as defect density continues to decline. Intel’s internal design teams are developing products for the node, while external customers are beginning to ask how much 14A production capacity the foundry can provide, according to Intel Chief Financial Officer David Zinsner.
Speaking at Deutsche Bank’s 2026 Technology Conference, Zinsner compared 14A’s development favorably with Intel’s highly successful 22nm process. However, the comparison comes with important qualifications: 14A is still expected to enter risk production in the second half of 2027, with high-volume manufacturing planned for 2028.
“When you look at the defect density, 14A is tracking better than the target curve we had for 14A,” Zinsner said at Deutsche Bank’s 2026 Technology Conference. “It is also doing better than any of the previous nodes in terms of how quickly we are bringing down the defects. In fact, we have not seen this performance since 22nm, which is arguably one of the best nodes Intel has ever put out.”
Zinsner’s comments indicate that, at this stage of development, 14A’s defect-reduction trajectory is at least as healthy as 22nm’s was at a comparable point in its development. That does not necessarily mean that 14A’s current defect density is equivalent to the 22nm process’s defect density two years before mass production.
Manufacturing and inspection equipment have also advanced significantly since 2010, meaning that a defect counted today may not be directly comparable with one Intel counted 16 years ago. In addition, defect density does not directly translate into final product yield.
Intel 14A process technology shows early progress
Intel’s 22nm process was the company’s first node to use FinFET transistors and was the world’s most advanced manufacturing technology when it launched. Other chipmakers did not adopt FinFET devices until their 14nm- and 16nm-class nodes arrived in 2014 and 2015.
Intel 14A will use second-generation gate-all-around RibbonFET transistors and second-generation backside power delivery, known as PowerDirect. The process will also support High-NA EUV lithography, enabled by highly complex patterning requirements.
Against that backdrop, Intel’s report of unusually strong defect-density reduction well ahead of high-volume manufacturing is encouraging. The comparison is particularly notable given Intel’s difficult experience with several successors to 22nm. Mass production of the company’s 14nm process was delayed by a year because of inadequate yields, its first-generation 10nm node failed to meet expectations, 20A was cancelled, and 18A had high defect density even as it reached a high-volume manufacturing milestone.
Intel has also disclosed very little information about the development progress of its Intel 4 and Intel 3 nodes.
External customers begin planning Intel 14A products
There are signs that 14A is gaining practical customer traction. External customers are developing products for the node, while their discussions with Intel have shifted from general interest to questions about capacity and supply.
“We are now seeing demand from our internal customers on 14A [and] they are actually probably the most cynical bunch out of anybody,” Zinsner said. “The fact that they are now designing products on 14A was a good confidence boost for us as well. Then, engagements with customers externally, from a foundry perspective has significantly increased. Lip-Bu and the team are now meeting on weekly basis with customers. They are moving away from just looking at data to thinking about ‘how much capacity can I get?’ ‘what does that supply look like?’ So, we are now at a point where we have conviction around customers on 14A externally as well.”
Intel began mass-producing its 22nm-based Ivy Bridge processors in late 2011 and early 2012, before releasing them commercially in late April 2012. The processors were highly successful, although overclockers criticized the inefficient thermal interface material between the die and integrated heat spreader.
Intel continued using its 22nm manufacturing technology for many years, first for CPUs from 2012 through 2016 and later for other products. The company similarly expects 14A to become a long-lasting process node.
